Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
نویسندگان
چکیده
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both the ductility and Cu leaching resistance of Sn-40Bi. The joint strength and thermal fatigue resistance of the Sn40Bi-0.1Cu solder joints are superior to those of Sn-37Pb.
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